| Model[1][2] | Launch | Code name(s) | Process | Transistors (billion) | Die size (mm2) |
Core config[a] | Cache | Core clock (MHz)[b] |
Fillrate[c][d] | Memory | Processing power (TFLOPS) | TDP | Bus interface | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| L1 | L2 | Pixel (GP/s) |
Texture (GT/s) |
Type | Size | Bandwidth (GB/s) |
Bus width | Clock (MT/s) |
Bfloat16 | Single precision |
Double precision | ||||||||||
| Data Center GPU Max 1100 | Jan 10, 2023 | Xe-HPC (Ponte Vecchio) |
Multiple[3] | 100 | 1280 | 7168:448:0:56:448:448 | 28 MB | 204 MB | 1000 1550 |
0 | 448.0 694.4 |
HBM2E | 48 GB | 1228.8 | 3072-bit | 3200 | 352 |
14.336 22.221 |
300 W | PCIe 5.0 x16 | |
| Data Center GPU Max 1350 | abandoned | 14336:896:0:112:896:896 | 56 MB | 408 MB | 750 1550 |
672.0 1388.8 |
96 GB | 2457.6 | 6144-bit | 704 |
21.504 44.442 |
450 W | |||||||||
| Data Center GPU Max 1550 | Jan 10, 2023 | 16384:1024:0:128:1024:1024 | 64 MB | 408 MB | 900 1600 |
921.6 1638.4 |
128 GB | 3276.8 | 8192-bit | 832 |
29.491 54.423 |
600 W | |||||||||
- ^ shading cores (ALU):texture mapping units (TMU):render output units (ROP):ray tracing units:tensor cores (XMX):execution Units
- ^ Boost values (if available) are stated below the base value in italic.
- ^ Pixel fillrate is calculated as the lowest of three numbers: number of ROPs multiplied by the base core clock speed, number of rasterizers multiplied by the number of fragments they can generate per rasterizer multiplied by the base core clock speed, and the number of streaming multiprocessors multiplied by the number of fragments per clock that they can output multiplied by the base clock rate.
- ^ Texture fillrate is calculated as the number of texture mapping units (TMUs) multiplied by the base (or boost) core clock speed.
Template documentation | You can . |
Common place to discuss layout and style of the Intel GPU tables at: Talk:List of Intel graphics processing units
References
- ^ "Intel® Data Center GPU Max Series". Intel.
- ^ "Intel Data Center GPU Max Series Overview". Intel. Retrieved 13 September 2023.
- ^ "Intel® Data Center GPU Max Series Product Brief" (PDF). Intel. 2023-08-15. Retrieved 2023-11-03.
Based on the Xe HPC architecture that uses both EMIB 2.5D and Foveros packaging technologies to combine 47 active tiles onto a single GPU, fabricated on five different process nodes, Intel Max Series GPUs enable greater flexibility and modularity in the construction of the SOC.