Talk:Semiconductor package

Things that could be in this article

• Origins - first unpackaged experimental devices, hand built experimental devices to mass production by millions
• Transistor manufacturing technology interacted with case design -point contact, germanium through to glass passivated silicon devices
• Objectives of a transistor package - keep out moisture, automatic assembly, mechanical protection of leads and die, low cost, heat dissipation, wave soldering, size, pick and place,markings, light sensitivity, oxidation, high frequency, high power
• Package problems - particles, moisture, light (and why plastic transistors are black), corrosion, cracking, delamination, broken bond wires, toxic beryllium oxide
• Historical device packages - GE top hat, see http://semiconductormuseum.com/ Transistor Museum, metal tubes, glass headers, derivation from miniature lamps, metal cases, permeable plastics, passivated devices tolerate non-hermectic packages
• Attaching the chip to the package - solder forms another junction
• Wire bonding - hand placed wires in early devices , different bond types, automation
• Lead frames
• Materials: ceramics,glass, plastics, Kovar, wire bonds, solders
• Heat dissipation design
• Key innovations in transistor package designs
• Specialist types of packages
  • High power
  • High frequency, microwave
  • Optical
  • Rugged
  • Subminiature and surface mount

• Military and aerospace requirements, acceptance for COTS plastic packages
• Socketed devices evolved to through-hole soldered to surface-mount soldered
• Failure modes
  • Particles
  • Moisture
  • Whiskers, electromigration
  • "Purple plague"

===Table of popular transistor cases===

Designation (organization), outline drawing, aprox overall dimensions, material, power dissip., and remarks

===Google books ===

• Makers of the Microchip: A Documentary History of Fairchild Semiconductor By Christophe La(c)Cuyer, Christophe Lécuyer, David C. Brock, Jay Last
• Encapsulation Technologies for Electronic Applications By Haleh Ardebili, Michael Pecht
• Electronic Materials Handbook: Packaging By Merrill L. Minges, ASM International. Handbook Committee

• Quick JEDEC transistor package outline finder/chooser image. - A problem with the provided JEDEC transistor outline external link page is that there is no simple way to choose or identify an outline transistor package without knowing the name of the package first e.g. TO-202 TO-92 etc Eromana (talk) 19:59, 13 March 2012 (UTC)

Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute

Here is an article that discuss about Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute for the future semiconductor packaging technology. Rjluna2 (talk) 16:23, 18 September 2023 (UTC)